Yaping Dan, Ruifeng Yue, Yan Wang, Yongzhao Yao, Yang Xu, Litian Liu
{"title":"PECVD法制备氮化氧硅的组成研究","authors":"Yaping Dan, Ruifeng Yue, Yan Wang, Yongzhao Yao, Yang Xu, Litian Liu","doi":"10.1109/ICSICT.2001.982086","DOIUrl":null,"url":null,"abstract":"A full range SiO/sub x/N/sub y/ from SiO/sub 2/ to Si/sub 3/N/sub 4/ is prepared by decomposing mixture of SiH/sub 4/, NH/sub 3/ and N/sub 2/O in commercial RF PECVD reactors. All samples are annealed in N/sub 2/ atmosphere for 30 min at 600/spl deg/C, 750/spl deg/C, 900/spl deg/C and analyzed by IR spectroscopy. It is shown that the main peak assigned to Si-(O, N) stretching mode downshifts when approaching to near stoichiometric Si/sub 3/N/sub 4/ and the segregation into Si/sub 3/N/sub 4/ and SiO/sub 2/ and Si(O/sub x/N/sub y/H/sub z/) tetrahedra from SiO/sub x/N/sub y/ occurs after 750/spl deg/C annealing.","PeriodicalId":349087,"journal":{"name":"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The composition study of silicon oxynitride prepared by PECVD\",\"authors\":\"Yaping Dan, Ruifeng Yue, Yan Wang, Yongzhao Yao, Yang Xu, Litian Liu\",\"doi\":\"10.1109/ICSICT.2001.982086\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A full range SiO/sub x/N/sub y/ from SiO/sub 2/ to Si/sub 3/N/sub 4/ is prepared by decomposing mixture of SiH/sub 4/, NH/sub 3/ and N/sub 2/O in commercial RF PECVD reactors. All samples are annealed in N/sub 2/ atmosphere for 30 min at 600/spl deg/C, 750/spl deg/C, 900/spl deg/C and analyzed by IR spectroscopy. It is shown that the main peak assigned to Si-(O, N) stretching mode downshifts when approaching to near stoichiometric Si/sub 3/N/sub 4/ and the segregation into Si/sub 3/N/sub 4/ and SiO/sub 2/ and Si(O/sub x/N/sub y/H/sub z/) tetrahedra from SiO/sub x/N/sub y/ occurs after 750/spl deg/C annealing.\",\"PeriodicalId\":349087,\"journal\":{\"name\":\"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)\",\"volume\":\"82 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT.2001.982086\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT.2001.982086","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The composition study of silicon oxynitride prepared by PECVD
A full range SiO/sub x/N/sub y/ from SiO/sub 2/ to Si/sub 3/N/sub 4/ is prepared by decomposing mixture of SiH/sub 4/, NH/sub 3/ and N/sub 2/O in commercial RF PECVD reactors. All samples are annealed in N/sub 2/ atmosphere for 30 min at 600/spl deg/C, 750/spl deg/C, 900/spl deg/C and analyzed by IR spectroscopy. It is shown that the main peak assigned to Si-(O, N) stretching mode downshifts when approaching to near stoichiometric Si/sub 3/N/sub 4/ and the segregation into Si/sub 3/N/sub 4/ and SiO/sub 2/ and Si(O/sub x/N/sub y/H/sub z/) tetrahedra from SiO/sub x/N/sub y/ occurs after 750/spl deg/C annealing.