D. Milojevic, Sachin Idgunji, Djordje Jevdjic, Emre Ozer, P. Lotfi-Kamran, Andreas Panteli, A. Prodromou, C. Nicopoulos, D. Hardy, B. Falsafi, Yiannakis Sazeides
{"title":"在高能效的片上服务器上对云工作负载进行热特性分析","authors":"D. Milojevic, Sachin Idgunji, Djordje Jevdjic, Emre Ozer, P. Lotfi-Kamran, Andreas Panteli, A. Prodromou, C. Nicopoulos, D. Hardy, B. Falsafi, Yiannakis Sazeides","doi":"10.1109/ICCD.2012.6378637","DOIUrl":null,"url":null,"abstract":"We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense and fast Through-Silicon Vias (TSVs) instead of off-chip IOs, enabling faster data transfers at much lower energy per bit. We demonstrate a methodology that includes full-system microarchitectural modeling and rapid virtual physical prototyping with emphasis on the thermal analysis. Our findings show that while executing CPU-centric benchmarks (e.g. SPECInt and Dhrystone), the temperature in the server-on-chip (logic+DRAM) is in the range of 175-200°C at a power consumption of less than 20W, exceeding the reliable operating bounds without any cooling solutions, even with embedded cores. However, with real cloud workloads, the power density in the server-on-chip remains much below the temperatures reached by the CPU-centric workloads as a result of much lower power burnt by memory-intensive cloud workloads. We show that such a server-on-chip system is feasible with a low-cost passive heat sink eliminating the need for a high-cost active heat sink with an attached fan, creating an opportunity for overall cost and energy savings in datacenters.","PeriodicalId":313428,"journal":{"name":"2012 IEEE 30th International Conference on Computer Design (ICCD)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Thermal characterization of cloud workloads on a power-efficient server-on-chip\",\"authors\":\"D. Milojevic, Sachin Idgunji, Djordje Jevdjic, Emre Ozer, P. Lotfi-Kamran, Andreas Panteli, A. Prodromou, C. Nicopoulos, D. Hardy, B. Falsafi, Yiannakis Sazeides\",\"doi\":\"10.1109/ICCD.2012.6378637\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense and fast Through-Silicon Vias (TSVs) instead of off-chip IOs, enabling faster data transfers at much lower energy per bit. We demonstrate a methodology that includes full-system microarchitectural modeling and rapid virtual physical prototyping with emphasis on the thermal analysis. Our findings show that while executing CPU-centric benchmarks (e.g. SPECInt and Dhrystone), the temperature in the server-on-chip (logic+DRAM) is in the range of 175-200°C at a power consumption of less than 20W, exceeding the reliable operating bounds without any cooling solutions, even with embedded cores. However, with real cloud workloads, the power density in the server-on-chip remains much below the temperatures reached by the CPU-centric workloads as a result of much lower power burnt by memory-intensive cloud workloads. We show that such a server-on-chip system is feasible with a low-cost passive heat sink eliminating the need for a high-cost active heat sink with an attached fan, creating an opportunity for overall cost and energy savings in datacenters.\",\"PeriodicalId\":313428,\"journal\":{\"name\":\"2012 IEEE 30th International Conference on Computer Design (ICCD)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-09-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 30th International Conference on Computer Design (ICCD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2012.6378637\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 30th International Conference on Computer Design (ICCD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2012.6378637","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal characterization of cloud workloads on a power-efficient server-on-chip
We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense and fast Through-Silicon Vias (TSVs) instead of off-chip IOs, enabling faster data transfers at much lower energy per bit. We demonstrate a methodology that includes full-system microarchitectural modeling and rapid virtual physical prototyping with emphasis on the thermal analysis. Our findings show that while executing CPU-centric benchmarks (e.g. SPECInt and Dhrystone), the temperature in the server-on-chip (logic+DRAM) is in the range of 175-200°C at a power consumption of less than 20W, exceeding the reliable operating bounds without any cooling solutions, even with embedded cores. However, with real cloud workloads, the power density in the server-on-chip remains much below the temperatures reached by the CPU-centric workloads as a result of much lower power burnt by memory-intensive cloud workloads. We show that such a server-on-chip system is feasible with a low-cost passive heat sink eliminating the need for a high-cost active heat sink with an attached fan, creating an opportunity for overall cost and energy savings in datacenters.