基于波形松弛和横向划分的高速互连快速电磁兼容分析

A. Sridhar, N. Nakhla, R. Achar, M. Nakhla
{"title":"基于波形松弛和横向划分的高速互连快速电磁兼容分析","authors":"A. Sridhar, N. Nakhla, R. Achar, M. Nakhla","doi":"10.1109/EPEP.2007.4387194","DOIUrl":null,"url":null,"abstract":"This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Fast EMC Analysis of High-Speed Interconnects via Waveform Relaxation and Transverse Partitioning\",\"authors\":\"A. Sridhar, N. Nakhla, R. Achar, M. Nakhla\",\"doi\":\"10.1109/EPEP.2007.4387194\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"109 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387194\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文提出了一种模拟存在电磁干扰的大量耦合互连的有效方法。该算法基于横向分割和波形松弛技术。与传统方法的三次以上增长相比,该算法的计算成本仅随行数线性增加。此外,该算法还提供了并行实现的方法,进一步节省了计算成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fast EMC Analysis of High-Speed Interconnects via Waveform Relaxation and Transverse Partitioning
This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信