SiGe器件和电路:与III/V相比优势在哪里?

U. Konig, A. Gruhle, A. Schuppen
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引用次数: 23

摘要

由于与现有硅技术的兼容性,SiGe器件正处于上升阶段。在高集成度,高产量和低成本的杰出SiGe集成电路制造的设想。关于频率,他们将填补标准Si和III/V之间的空白。在某些方面,如低频和高频噪声,低功耗SiGe异质双极晶体管(HBTs)优于III/V-HBTs,并接近一些高电子迁移率晶体管(HEMTS)的性能,至少低于10 GHz。本文综述了电子SiGe异质器件的发展现状和潜力,并与各自的III/V器件进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SiGe devices and circuits: where are advantages over III/V ?
SiGe devices are just on an upswing due to their compatibility with existing silicon technologies. Outstanding SiGe ICs manufactured at high integration levels, high volume and low cost are envisaged. Concerning frequency they will fill the gap between standard Si and III/V. In some aspects like low-frequency and high-frequency noise, and low power consumption SiGe hetero bipolar transistors (HBTs) are advantageous over III/V-HBTs and approach the performance of some high electron mobility transistors (HEMTS), at least below 10 GHz. The paper reviews state of the art and potential of electronic SiGe heterodevices and tries a comparison to respective III/V devices.
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