A. Tchegho, B. Muenstermann, C. Gutsche, A. Poloczek, K. Blekker, Werner Prost, F. Tegude
{"title":"具有低串联电阻的可扩展大电流密度rtd","authors":"A. Tchegho, B. Muenstermann, C. Gutsche, A. Poloczek, K. Blekker, Werner Prost, F. Tegude","doi":"10.1109/ICIPRM.2010.5516377","DOIUrl":null,"url":null,"abstract":"InP-based double-barrier resonant tunnelling diodes have been optimized for high speed digital circuits. We present the scalability of high current density (JP ≈ 150 kA/cm2;) resonant tunnelling diodes in the sub-micrometer electrode area range. A small signal equivalent circuit has been developed and its parameters are precisely deduced from DC and RF measurements. Based on this model the scalability has been investigated with emphasis on a low but also scalable series resistance in order to keep the peak voltage constant. A comparison of dry and wet etching methods in the device fabrication will be presented. A multiple mesa concept has been adopted to provide reliable scalability at low emitter area (AE < 1 µm2).","PeriodicalId":197102,"journal":{"name":"2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"198 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-07-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Scalable high-current density RTDs with low series resistance\",\"authors\":\"A. Tchegho, B. Muenstermann, C. Gutsche, A. Poloczek, K. Blekker, Werner Prost, F. Tegude\",\"doi\":\"10.1109/ICIPRM.2010.5516377\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"InP-based double-barrier resonant tunnelling diodes have been optimized for high speed digital circuits. We present the scalability of high current density (JP ≈ 150 kA/cm2;) resonant tunnelling diodes in the sub-micrometer electrode area range. A small signal equivalent circuit has been developed and its parameters are precisely deduced from DC and RF measurements. Based on this model the scalability has been investigated with emphasis on a low but also scalable series resistance in order to keep the peak voltage constant. A comparison of dry and wet etching methods in the device fabrication will be presented. A multiple mesa concept has been adopted to provide reliable scalability at low emitter area (AE < 1 µm2).\",\"PeriodicalId\":197102,\"journal\":{\"name\":\"2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)\",\"volume\":\"198 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-07-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICIPRM.2010.5516377\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIPRM.2010.5516377","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Scalable high-current density RTDs with low series resistance
InP-based double-barrier resonant tunnelling diodes have been optimized for high speed digital circuits. We present the scalability of high current density (JP ≈ 150 kA/cm2;) resonant tunnelling diodes in the sub-micrometer electrode area range. A small signal equivalent circuit has been developed and its parameters are precisely deduced from DC and RF measurements. Based on this model the scalability has been investigated with emphasis on a low but also scalable series resistance in order to keep the peak voltage constant. A comparison of dry and wet etching methods in the device fabrication will be presented. A multiple mesa concept has been adopted to provide reliable scalability at low emitter area (AE < 1 µm2).