纳米时代稳健SRAM设计的统计失效分析

Young-Gu Kim, Soo-Hwan Kim, H. Lim, Sanghoon Lee, Keun-Ho Lee, Young-Kwan Park, Moon-Hyun Yoo
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引用次数: 1

摘要

在大规模集成电路制造中,工艺变异性的增加与积极的技术缩放导致了许多生产力问题。对工艺变异性和失效之间的关系进行了分析,以便在技术和设计方面为良率优化指定指导方针。通过应用所提出的方法,确定了200 MHz SRAM的核心方案和工作电压,以确保对操作故障的抗扰性。从DFM的角度来看,对失效特性进行统计电路分析是保证制造过程中良率最优的必要条件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Statistical Failure Analysis for the Design of Robust SRAM in Nano-Scale Era
Increase of the process variability with aggressive technology scaling causes many productivity issues in VLSI manufacturing. Analysis about the relationship between process variability and failure has been performed to specify guidelines in both technology and design aspects for yield optimization. By applying the proposed methodology, the core scheme and the operating voltage of the 200 MHz SRAM were determined to secure the immunity to operational failures. In DFM point of view, the statistical circuit analysis for failure characteristics is indispensable to guarantee an optimal yield in manufacturing.
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