{"title":"智能纺织品中消失电子器件的技术","authors":"S. Jung, C. Lauterbach, M. Strasser, W. Weber","doi":"10.1109/ISSCC.2003.1234347","DOIUrl":null,"url":null,"abstract":"Enabling technologies for 'wearable electronics', such as packaging and interconnect, are the key to the integration of electronics in textiles. A silicon-based micromachined thermoelectric generator chip for energy harvesting from body heat, and an interwoven antenna concept for textile radio frequency identification labels are presented.","PeriodicalId":171288,"journal":{"name":"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-02-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"85","resultStr":"{\"title\":\"Enabling technologies for disappearing electronics in smart textiles\",\"authors\":\"S. Jung, C. Lauterbach, M. Strasser, W. Weber\",\"doi\":\"10.1109/ISSCC.2003.1234347\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Enabling technologies for 'wearable electronics', such as packaging and interconnect, are the key to the integration of electronics in textiles. A silicon-based micromachined thermoelectric generator chip for energy harvesting from body heat, and an interwoven antenna concept for textile radio frequency identification labels are presented.\",\"PeriodicalId\":171288,\"journal\":{\"name\":\"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-02-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"85\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2003.1234347\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2003.1234347","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Enabling technologies for disappearing electronics in smart textiles
Enabling technologies for 'wearable electronics', such as packaging and interconnect, are the key to the integration of electronics in textiles. A silicon-based micromachined thermoelectric generator chip for energy harvesting from body heat, and an interwoven antenna concept for textile radio frequency identification labels are presented.