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热循环阶跃应力试验预测电子封装胶粘剂疲劳寿命

Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318) Pub Date : 2002-08-07 DOI:10.1109/RAMS.2002.981713
X. Tian, J. Prince
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引用次数: 2

摘要

在本研究中，建立了一种利用阶跃应力热循环预测特定电子封装胶粘剂疲劳寿命的方法。利用有限元分析软件生成数值解，并与试验数据进行比较。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Electronic packaging adhesive fatigue life prediction using thermal cycling step-stress testing
In this research, a methodology of using step-stress thermal cycling to predict fatigue life for a specific electronic packaging adhesive is established. Numerical solutions are generated using FEA software and these data are compared to test data.
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Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)
Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318)
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