自动化包装设计的信号完整性顾问

Proceedings of IEEE Electrical Performance of Electronic Packaging Pub Date : 1993-10-20 DOI:10.1109/EPEP.1993.394591

S. Simovich, S. Mehrotra, P. Franzon, M. Steer, Z. Rakib, G. Simpson

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引用次数: 2

摘要

提出了一种新的方法，其中信号完整性工程师和设计工程师与自动化工具交互，以产生印刷电路板(PCB)或多芯片模块(MCM)布局。重点是信号完整性工程师如何使用这些工具取得最大的成功。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A signal integrity advisor for automated packaging design

A new methodology is presented in which the signal integrity engineer and the design engineer interact with automation tools to produce a printed circuit board (PCB) or multi-chip module (MCM) layout. The focus is on how the signal integrity engineer uses these tools for greatest success.<>

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来源期刊

Proceedings of IEEE Electrical Performance of Electronic Packaging

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