结合二维TLM的电源-地平面垂直互连射频建模

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967677

R. Ito, R. Carrillo-Ramirez, R. Jackson

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引用次数: 5

摘要

在本文中，我们提出了一种建模技术，用于寻找可与粗网格二维传输线矩阵方法(2D-TLM)分析结合使用的通孔互连的集总元素模型。该技术允许使用非常简单的二维TLM分析来同时计算插入损耗、回波损耗和多层封装中通过电源-地平面对的多个过路转换的隔离。通过与HFSS的比较，验证了该技术的准确性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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RF modeling of vertical interconnection between power-ground plane combined with 2D TLM

In this paper, we present a modeling technique for finding a lumped element model of a via interconnection that can be used in conjunction with a coarse grid two-dimensional transmission line matrix method (2D-TLM) analysis. The technique allows the use of very simple 2D TLM analysis to simultaneously compute insertion loss, return loss, and isolation of multiple via transitions through a power-ground plane pair in a multilayer package. The accuracy of this technique is validated by comparison to HFSS.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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