摩尔:从设备扩展到3D集成和系统技术协同优化

2017 Silicon Nanoelectronics Workshop (SNW) Pub Date : 2017-06-01 DOI:10.23919/SNW.2017.8242328

N. Collaert

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引用次数: 2

摘要

在本文中，我们将回顾当前的挑战和进展，以继续超越5nm技术节点的标准器件扩展。除了引入新材料和设备概念外，我们还将解决需要技术和系统优化之间密切互动的更异构系统的趋势。

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More Moore: From device scaling to 3D integration and system-technology co-optimization

In this paper, we will review the current challenges and advancements to continue standard device scaling beyond the 5nm technology node. Apart from the introduction of new materials and device concepts, we will also address the trend towards more heterogeneous systems requiring close interaction between the technology and system optimization.

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来源期刊

2017 Silicon Nanoelectronics Workshop (SNW)

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