二极管激光泵浦下掺钕LaSc3(BO3)4和CdVO4晶体的比较

V. Ostroumov, T. Jensen, J. Meyn, G. Huber, V. Tsvetkov, I. Shcherbakov, A. I. Zagumennyi
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引用次数: 0

摘要

微芯片激光器要求激光介质具有高吸收效率、高斜率效率和低阈值。从这个角度来看,选择的材料可能是Nd: LaSc3(BO3)4 (Nd:LSB)和Nd:GdVO4 (Nd:GVO)。这些晶体的主要特征是808 nm附近的强而宽的吸收带,GVO在1.06 μm处的发射截面非常高,LSB的发射线很宽(表1)。在二极管泵浦下,1-1.5 mm长的GVO和LSB晶体在1.06 μm处的输出功率超过850 mW,斜率效率接近60%。1,2为了获得与Nd:YAG相同的结果,必须使用5-8毫米长的晶体。另一方面,LSB和GVO比YAG更容易受到热问题的影响,需要重新调整以补偿热透镜,以保持良好的光束轮廓。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of neodymium-doped LaSc3(BO3)4 and CdVO4 crystals under diode laser pumping
Microchip lasers require a laser medium with high absorption and slope efficiency and a low threshold. From this point of view the materials of choice might be Nd: LaSc3(BO3)4 (Nd:LSB) and Nd:GdVO4 (Nd:GVO). The main features of these crystals are strong and broad absorption bands near 808 nm, a very high emission cross section at 1.06 μm for GVO, and broad emission line of LSB (Table 1). Under diode pumping 1-1.5 mm long GVO and LSB crystals demonstrate more than 850 mW of output power at 1.06 μm with a slope efficiency close to 60%.1,2 In order to achieve the same results with Nd:YAG it is necessary to use a 5-8 mm-long crystal. On the other hand both LSB and GVO suffer more from the thermal problems than YAG and require re-adjustment to compensate the thermal lens in order to maintain a good beam profile.
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