非等温模拟优化SiC mosfet以增强短路稳健性

Dongyoung Kim, Adam J. Morgan, Nick Yun, Woongje Sung, A. Agarwal, R. Kaplar
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引用次数: 7

摘要

对SiC mosfet的短路(SC)行为进行了非等温模拟。利用所建立的模型,提出了提高SC坚固性的结构方案。薄的栅极氧化物和窄的JFET区域可以降低饱和电流,增强SC的坚固性,而不会增加Ron,sp。结果表明,薄栅氧化物提供了适度的改善SC能力,代价是增加Cgs。相比之下,狭窄的JFET区域提供了更好的(2倍)SC坚固性,以及更低的Ron,sp,对Cgs没有负面影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Non-Isothermal Simulations to Optimize SiC MOSFETs for Enhanced Short-Circuit Ruggedness
Non-Isothermal simulations to understand Short-Circuit (SC) behavior of SiC MOSFETs were performed. Using the established model, structures to enhance the SC ruggedness were proposed. Thin gate oxide and a narrow JFET region are shown to reduce saturation current enhancing SC ruggedness without increasing Ron,sp. Results indicate thin gate oxide offers moderate improvement in SC capability, at the cost of increased Cgs. In contrast, narrow JFET region provides much improved (2×) SC ruggedness, as well as lower Ron,sp, with no negative impact on Cgs.
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