偏靶离子束沉积制备Si1−xGex薄膜的纳米压痕

R. Ge, X. Hou, K. Brookshire, N. Krishnan, Dilusha Silva, J. Bumgarner, Yinong Liu, L. Faraone, M. Martyniuk
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引用次数: 4

摘要

采用纳米压痕法研究了Si1-xGex薄膜的力学性能。采用偏靶离子束沉积(BTIBD)法制备了Si1-xGex薄膜。研究了不同硅锗配比对合金薄膜弹性模量和硬度的影响。与纯BTIBD Si (Esi = 154GPa, Hsi = 9.9GPa)相比,Si1-xGex的杨氏模量和硬度随Ge含量的增加而下降,si0.5 - ge0.5的杨氏模量和硬度分别为139 GPa和8.4GPa。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Nanoindentation of Si1−xGex thin films prepared by biased target ion beam deposition
The mechanical properties of Si1-xGex thin films are studied via nanoindentation. The Si1-xGex thin films are prepared with a biased target ion beam deposition (BTIBD) method. We investigate the effect of varying the Si to Ge composition ratio on the elastic modulus and hardness of the resulting alloyed films. In comparison to pure BTIBD Si (Esi = 154GPa, Hsi = 9.9GPa), for Si1-xGex a decreasing trend in Young's modulus and hardness is observed to be associated with the increase in Ge content, and for Si0.5Ge0.5 the values of 139 GPa and 8.4GPa are found to represent the Young's modulus and hardness, respectively.
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