具有C4互连的MLC去耦电容器的可靠性和特性

D. Scheider, D. Hopkins, P. Zucco, Edward Moszczynski, M. Griffin, M. Takács, J. Galvagni
{"title":"具有C4互连的MLC去耦电容器的可靠性和特性","authors":"D. Scheider, D. Hopkins, P. Zucco, Edward Moszczynski, M. Griffin, M. Takács, J. Galvagni","doi":"10.1109/ECTC.1996.517415","DOIUrl":null,"url":null,"abstract":"Multilayer ceramic (MLC) capacitors are composite structures made of alternating layers of ceramic (dielectric material) and metal (electrodes). The dielectric material is barium titanate-based ceramic and the electrodes are made of platinum. C4 (controlled collapse chip connections) technology is used to provide multiple attachment points to substrates. A high dielectric constant of barium titanate-based ceramic helps to achieve a large capacitance/size ratio. The capacitance ranges from 32 nF to 100 nF in body sizes up to 1.85/spl times/1.6/spl times/0.85 mm. In this paper, we cover design, reliability and electrical characterization of capacitors with C4 interconnections. Reliability stress tests performed during qualification were designed to cover a wide range of field applications and included stress tests such as liquid to liquid thermal shock, moisture resistance and thermal cycles per Mil.Std., high temperature bias, temperature humidity bias and tensile pull. A visual inspection of parts post stress and physical analysis of unstressed parts were also performed. The parameters monitored during stress testing were: capacitance, leakage current and plate resistance. The electrical characterization measurements included effects of frequency, temperature and voltage. Inductance measurements were included based on a self-resonance technique.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Reliability and characterization of MLC decoupling capacitors with C4 interconnections\",\"authors\":\"D. Scheider, D. Hopkins, P. Zucco, Edward Moszczynski, M. Griffin, M. Takács, J. Galvagni\",\"doi\":\"10.1109/ECTC.1996.517415\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Multilayer ceramic (MLC) capacitors are composite structures made of alternating layers of ceramic (dielectric material) and metal (electrodes). The dielectric material is barium titanate-based ceramic and the electrodes are made of platinum. C4 (controlled collapse chip connections) technology is used to provide multiple attachment points to substrates. A high dielectric constant of barium titanate-based ceramic helps to achieve a large capacitance/size ratio. The capacitance ranges from 32 nF to 100 nF in body sizes up to 1.85/spl times/1.6/spl times/0.85 mm. In this paper, we cover design, reliability and electrical characterization of capacitors with C4 interconnections. Reliability stress tests performed during qualification were designed to cover a wide range of field applications and included stress tests such as liquid to liquid thermal shock, moisture resistance and thermal cycles per Mil.Std., high temperature bias, temperature humidity bias and tensile pull. A visual inspection of parts post stress and physical analysis of unstressed parts were also performed. The parameters monitored during stress testing were: capacitance, leakage current and plate resistance. The electrical characterization measurements included effects of frequency, temperature and voltage. Inductance measurements were included based on a self-resonance technique.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.517415\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.517415","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

摘要

多层陶瓷(MLC)电容器是由陶瓷(介电材料)和金属(电极)交替层制成的复合结构。电介质材料是钛酸钡基陶瓷,电极由铂制成。C4(受控折叠芯片连接)技术用于为基板提供多个附着点。钛酸钡基陶瓷的高介电常数有助于实现大的电容/尺寸比。电容范围为32nf至100nf,机身尺寸可达1.85/spl倍/1.6/spl倍/0.85 mm。在本文中,我们介绍了C4互连电容器的设计,可靠性和电气特性。在鉴定期间进行的可靠性压力测试旨在涵盖广泛的现场应用,包括压力测试,如液体对液体热冲击、防潮性和Mil.Std的热循环。、高温偏置、温湿度偏置和拉伸拉力。零件后应力目视检查和无应力零件的物理分析也进行了。应力测试监测的参数有:电容、漏电流和极板电阻。电特性测量包括频率、温度和电压的影响。电感测量包括基于自共振技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability and characterization of MLC decoupling capacitors with C4 interconnections
Multilayer ceramic (MLC) capacitors are composite structures made of alternating layers of ceramic (dielectric material) and metal (electrodes). The dielectric material is barium titanate-based ceramic and the electrodes are made of platinum. C4 (controlled collapse chip connections) technology is used to provide multiple attachment points to substrates. A high dielectric constant of barium titanate-based ceramic helps to achieve a large capacitance/size ratio. The capacitance ranges from 32 nF to 100 nF in body sizes up to 1.85/spl times/1.6/spl times/0.85 mm. In this paper, we cover design, reliability and electrical characterization of capacitors with C4 interconnections. Reliability stress tests performed during qualification were designed to cover a wide range of field applications and included stress tests such as liquid to liquid thermal shock, moisture resistance and thermal cycles per Mil.Std., high temperature bias, temperature humidity bias and tensile pull. A visual inspection of parts post stress and physical analysis of unstressed parts were also performed. The parameters monitored during stress testing were: capacitance, leakage current and plate resistance. The electrical characterization measurements included effects of frequency, temperature and voltage. Inductance measurements were included based on a self-resonance technique.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信