等时退火对金属有机化学气相沉积制备的砷化镓薄膜空穴阱演化的影响

Q. Gao, H. Tan, C. Jagadish, P. Deenapanray
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引用次数: 0

摘要

利用深能级瞬态光谱(DLTS)研究了金属有机化学气相沉积(MOCVD)快速热退火p型GaAsN外延层中电活性缺陷的演变过程。在生长层中观察到连续分布的空穴陷阱和重叠的少数载流子陷阱。通过快速热退火(RTA),在600/spl℃~ 900/spl℃的温度范围内30 s形成了HA1 (E/sub V/+0.22 eV)、HA2 (E/sub V/+0.32 eV)、HA3 (E/sub V/+0.38 eV)、HA4 (E/sub V/+0.39 eV)、HA5 (E/sub V/+0.55 eV)和HA6 (E/sub V/+0.78 eV)六个空穴阱。虽然这些缺陷的相对浓度随RTA温度的变化而变化,但大多数缺陷在900/spl℃时是稳定的。在文献报道的基础上,对这些空穴圈闭的起源进行了研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of isochronal annealing on the evolution of hole traps in GaAsN epilayers grown by metalorganic chemical vapor deposition
The evolution of electrically active defects in rapid thermally annealed p-type GaAsN epitaxial layers grown by metalorganic chemical vapor deposition (MOCVD) was studied by deep level transient spectroscopy (DLTS). A continuous distribution of hole traps and an overlapping minority carrier trap are observed in the as-grown layers. Six hole traps HA1 (E/sub V/+0.22 eV), HA2 (E/sub V/+0.32 eV), HA3 (E/sub V/+0.38 eV), HA4 (E/sub V/+0.39 eV), HA5 (E/sub V/+0.55 eV), and HA6 (E/sub V/+0.78 eV) were created by rapid thermal annealing (RTA) in the temperature range of 600/spl deg/C-900/spl deg/C for 30 s. Most of these defects are stable at 900/spl deg/C, although their relative concentrations varied over the RTA temperature. The origin of these hole traps was studied based on previously reported hole traps in the literature.
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