首次尝试实现(多qhe器件)串联阵列电阻标准

1998 Conference on Precision Electromagnetic Measurements Digest (Cat. No.98CH36254) Pub Date : 1998-07-06 DOI:10.1109/CPEM.1998.699977

F. Piquemal, J. Blanchet, G. Genevès, J. André

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引用次数: 37

摘要

本文表明，由具有相同密度和迁移率的多个QHE器件组成的7.5/spl倍/5.5 mm/sup /的单芯片是存在可能性的。介绍了一些装置串联放置的样品的计量特性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A first attempt to realize (multiple-QHE devices)-series array resistance standards

This paper shows that the possibility exists to fabricate a single chip of 7.5/spl times/5.5 mm/sup 2/ composed of several QHE devices having the same density and mobility. Metrological characteristics of some samples with devices placed in series are described.

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来源期刊

1998 Conference on Precision Electromagnetic Measurements Digest (Cat. No.98CH36254)

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