O. Aubel, S. Thierbach, R. Seidel, B. Freudenberg, M. Meyer, F. Feustel, J. Poppe, M. Nopper, A. Preusse, C. Zistl, K. Weide-Zaage
{"title":"用于亚μm尺寸大批量生产的cop金属帽单元工艺的综合可靠性分析","authors":"O. Aubel, S. Thierbach, R. Seidel, B. Freudenberg, M. Meyer, F. Feustel, J. Poppe, M. Nopper, A. Preusse, C. Zistl, K. Weide-Zaage","doi":"10.1109/RELPHY.2008.4558983","DOIUrl":null,"url":null,"abstract":"Reliability of copper interconnect systems is very sensitive to the maximum current used in the product. In this paper we present the results of advanced process improvements leading to very reliable full-build interconnect systems ready for high volume production. Besides the electromigration investigation, we studied stress migration performance as well as BTS and leakage measurements. We found behavior changes in almost all reliability tests suggesting differences in physical behavior, while exhibiting very strong lifetime performance.","PeriodicalId":187696,"journal":{"name":"2008 IEEE International Reliability Physics Symposium","volume":"105 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-μm dimensions\",\"authors\":\"O. Aubel, S. Thierbach, R. Seidel, B. Freudenberg, M. Meyer, F. Feustel, J. Poppe, M. Nopper, A. Preusse, C. Zistl, K. Weide-Zaage\",\"doi\":\"10.1109/RELPHY.2008.4558983\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Reliability of copper interconnect systems is very sensitive to the maximum current used in the product. In this paper we present the results of advanced process improvements leading to very reliable full-build interconnect systems ready for high volume production. Besides the electromigration investigation, we studied stress migration performance as well as BTS and leakage measurements. We found behavior changes in almost all reliability tests suggesting differences in physical behavior, while exhibiting very strong lifetime performance.\",\"PeriodicalId\":187696,\"journal\":{\"name\":\"2008 IEEE International Reliability Physics Symposium\",\"volume\":\"105 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.2008.4558983\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.2008.4558983","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-μm dimensions
Reliability of copper interconnect systems is very sensitive to the maximum current used in the product. In this paper we present the results of advanced process improvements leading to very reliable full-build interconnect systems ready for high volume production. Besides the electromigration investigation, we studied stress migration performance as well as BTS and leakage measurements. We found behavior changes in almost all reliability tests suggesting differences in physical behavior, while exhibiting very strong lifetime performance.
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