{"title":"采用常规旋转摩擦焊接工艺研究异种材料连接处的可焊性","authors":"P.S.P. Monteiro, F. Y. Nakamoto, G. Santos","doi":"10.32640/tasj.2018.2.76","DOIUrl":null,"url":null,"abstract":"The objective of this project is to study the behavior of weldability, heat affected zone and thermal conductivity of the solid state junctions for various applications. The joints will be obtained through the conventional rotary friction (FW) process, combining the heat generated through the friction of two surfaces and bonding by hot forging, produced at temperatures lower than the melting temperature of the base materials. The results will be analyzed through mechanical stress tests such as tensile, compression, folding, Vickers microhardness, Charpy impact and metallographic. The strength of the joint will be analyzed given some input variables such as: friction time, forging pressure and speed of rotation.","PeriodicalId":227717,"journal":{"name":"The Academic Society Journal","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Study of weldability in junction of dissimilar materials using the welding process by conventional rotary friction – FW\",\"authors\":\"P.S.P. Monteiro, F. Y. Nakamoto, G. Santos\",\"doi\":\"10.32640/tasj.2018.2.76\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The objective of this project is to study the behavior of weldability, heat affected zone and thermal conductivity of the solid state junctions for various applications. The joints will be obtained through the conventional rotary friction (FW) process, combining the heat generated through the friction of two surfaces and bonding by hot forging, produced at temperatures lower than the melting temperature of the base materials. The results will be analyzed through mechanical stress tests such as tensile, compression, folding, Vickers microhardness, Charpy impact and metallographic. The strength of the joint will be analyzed given some input variables such as: friction time, forging pressure and speed of rotation.\",\"PeriodicalId\":227717,\"journal\":{\"name\":\"The Academic Society Journal\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Academic Society Journal\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.32640/tasj.2018.2.76\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Academic Society Journal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.32640/tasj.2018.2.76","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study of weldability in junction of dissimilar materials using the welding process by conventional rotary friction – FW
The objective of this project is to study the behavior of weldability, heat affected zone and thermal conductivity of the solid state junctions for various applications. The joints will be obtained through the conventional rotary friction (FW) process, combining the heat generated through the friction of two surfaces and bonding by hot forging, produced at temperatures lower than the melting temperature of the base materials. The results will be analyzed through mechanical stress tests such as tensile, compression, folding, Vickers microhardness, Charpy impact and metallographic. The strength of the joint will be analyzed given some input variables such as: friction time, forging pressure and speed of rotation.
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京公网安备 11010802042870号
