基于近场磁扫描技术的SiC功率模块封装设计研究

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-01 DOI:10.1109/IWIPP.2017.7936770

T. Ibuchi, Eisuke Masuda, T. Funaki, H. Otake, T. Miyazaki, Yasuo Kanetake, Takashi Nakamura

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引用次数: 10

摘要

本文主要研究磁近场强识别模块中的电流分布，以优化碳化硅(SiC)功率模块的布局和封装设计。这种测量方法可以直观地显示模块中接线模式上的实际电流分布，并可以估计半桥直流链路中缓冲电容抑制电压过冲和振铃振荡的效果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A study on packaging design of SiC power module using near-field magnetic scanning techniques

This report focuses the current distribution in a module identifiedwith magnetic near-field intensity for optimizing layout and packaging design of silicon carbide (SiC) power module. This measurement methodology can visualize the practical current distribution on a wiring pattern in a module and can estimate the effect of snubber capacitor in a DC-link of half-bridge to suppress the voltage overshoot and ringing oscillation.

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来源期刊

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)

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