微孔电镀过程的数值模拟

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529989

N. Strusevich, C. Bailey, S. Costello, M. Patel, M. Desmulliez

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引用次数: 6

摘要

对于小特征电沉积的数值模拟，我们开发了一种新的方法，可以明确跟踪电解质和沉积金属之间的界面。该方法在CFD软件包physa中实现，并通过将交付的模拟结果与实际测量结果和/或使用另一个软件COMSOL Multiphysics(使用标准电沉积模块)获得的结果进行比较来验证。

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Numerical modeling of the electroplating process for microvia fabrication

For numerical simulation of electrodeposition in small features, we have developed a novel method that allows an explicit tracking of the interface between the electrolyte and the deposited metal. The method is implemented in the CFD package PHYSICA and validated by comparing the delivered simulation results with those achieved by real-life measurements and/or obtained by another piece of software, COMSOL Multiphysics using a standard electrodeposition module.

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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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