信息分配网络的光互连

W. Wren, J. Bristow, M. Hibbs-Brenner, R. Morgan
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引用次数: 0

摘要

用于信息分发的光互连具有高距离带宽产品、高密度、抗电磁干扰以及在某些情况下减轻重量和体积的优点。本文介绍了霍尼韦尔正在开发的几种互连技术。串行、高速(约1 Gbit/sec)光纤数据通信模块正在开发中,用于局域网、外设链接和超级计算机机柜到机柜互连等应用。这些模块被整合到“PRISM”计划下的电路板上,将被插入到英特尔Paragon超级计算机中,以使这台机器能够扩展到两排机柜,间隔10-20米。聚合物波导用于提供高密度板和背板集成光互连,也用于在多芯片模块(MCM)中使用传统制造工艺将光电器件与传统电子芯片封装在一起。扩展光束平行波导连接器允许32个光通道取代标准SEM-E连接器中的一个电引脚。聚合物波导的互连密度为50/mm,并已在工业标准的燃烧过程中与传统电路板材料集成。在未来3到5年的时间框架内,系统将需要在板和背板级进行光互连,如果互连不会对系统性能造成不良影响的话。我们证明了板可积波导是嵌入式系统的最佳选择。给出了一个互连性能图,表明聚酰亚胺波导的速度-密度-功率比铜互连提高20倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optical interconnects for information distribution networks
Optical interconnections for information distribution provide advantages of a high distance-bandwidth product, high density, immunity to EMI and in some cases reduced weight and volume. This paper describes several interconnect technologies being developed at Honeywell. Serial, high speed (approximately 1 Gbit/sec) fiber optic data communication modules are being developed for applications including local area networks, links to peripherals and supercomputer cabinet-to-cabinet interconnects. These modules are being incorporated onto boards under the "PRISM" program to be inserted in the Intel Paragon supercomputer in order to enable this machine to be expanded to two rows of cabinets separated by 10-20 meters. Polymer waveguides are used to provide high density board and backplane integrated optical interconnects, and are also used to package optoelectronic devices together with conventional electronic die in multichip modules (MCM) using conventional fabrication procedures. An expanded beam parallel waveguide connector allows 32 optical channels to replace one electrical pin in a standard SEM-E connector. Polymer waveguides have interconnect densities 50/mm, and have been integrated with conventional circuit board material in industry-standard flamination processes. Systems in the next 3 to 5 year time frame will need optical interconnects at the board and backplane level if the interconnects are not to force undesirable compromises in system performance. We show that board-integrable waveguides represent the optimum choice for embedded systems. An interconnect figure-of-merit is given which shows that polyimide waveguides promise a factor of 20 speed-density-power improvement over copper interconnects.
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