利用耦合电路和电磁仿真分析母线同步开关噪声

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967646

Y. Mabuchi, M. Suwa, H. Fukumoto, A. Nakamura

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引用次数: 1

摘要

利用耦合电路和电磁仿真技术对印刷电路板和LSI封装进行精确建模，计算出母线同步开关噪声(SSN)。定性地估计了串扰和地面反弹对SSN的贡献。在BGA等电感相对较低的封装中，产生SSN的主要原因是串扰，串扰导致SSN电压沿母线长度增加。仿真结果与实验结果进行了比较，两者在SSN最大峰处的差异在10%以内。

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Simultaneous switching noise analysis on bus lines using coupled circuit and electromagnetic simulation

Simultaneous switching noise (SSN) on bus lines is calculated by accurately modeling printed circuit boards and LSI packages using coupled circuit and electromagnetic simulation. Contribution of crosstalk and ground bounce to SSN is qualitatively estimated. With relatively low inductance package such as BGA, the main cause of SSN is cross talk which results in increasing SSN voltage along the length of bus line. The results of simulation are compared with those of experiment, the both results agree within 10% difference at maximum peak of SSN.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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