考虑密集过孔的复杂配电网分析

Young-Seok Hong, Heeseok Lee, Joon-Ho Choi, Moon-Hyun Yoo, J. Kong
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引用次数: 6

摘要

由于高速低功耗的发展趋势,多层印刷电路板(pcb)中的配电网络(PDN)在系统性能方面起着举足轻重的作用。本文提出了一种在频域考虑了密集的电源/地孔和信号过孔的影响下,对不规则形状的电源/地面对进行有效分析的方法。平面根据几何性质划分,采用平行板传输线理论建模。为了检验各种通孔效应,我们根据通孔的性质,如功率、接地和信号,建立了模型。利用传统的电路模拟器,研究了电源/地平面的输入阻抗和反阻抗。由于该方法准确、快速,可以有效地应用于多层PCB结构的早期设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis for complex power distribution networks considering densely populated vias
Due to the high speed and low power trends, the power distribution network (PDN) in multilayer printed circuit boards (PCBs) plays a pivotal role in terms of system performance. The paper presents an efficient analysis method for the irregularly shaped power/ground plane pair considering the effect of densely populated power/ground and signal vias in the frequency domain. The plane is divided based on geometric properties and modeled by the parallel-plate transmission line theory. For examination of various via effects, we have modeled vias according to their properties, such as power, ground and signal. Using a conventional circuit simulator, the input- and trans-impedance of power/ground planes are investigated. Since the proposed method is accurate as well as fast, it can be efficiently applied to multilayered PCB structures at the early design stage.
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