通过晶圆级排列晶圆键合实现三维集成

2015 International Semiconductor Conference (CAS) Pub Date : 2015-10-01 DOI:10.1109/SMICND.2015.7355203

V. Dragoi, J. Burggraf, F. Kurz, B. Rebhan

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引用次数: 5

摘要

晶圆键合是一种有吸引力的技术，可以制造复杂的晶圆级3D架构。对器件尺寸缩小和性能改进的持续需求推动了新制造技术的发展。本文综述了晶圆键合工艺的主要挑战，并介绍了对准晶圆键合工艺的新发展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D integration by wafer-level aligned wafer bonding

Wafer bonding is an attractive technology enabling manufacturing of complex wafer-level 3D architectures. The continuous demand for device size shrinking and performance improvement pushed for the development of new manufacturing technologies. This work reviews the main challenging raised for the wafer bonding processes and presents new developments in the aligned wafer bonding processes.

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2015 International Semiconductor Conference (CAS)

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