{"title":"聚酰亚胺层间绝缘工艺/设计限制","authors":"D. Bergeron, J. P. Kent, K. Morrett","doi":"10.1109/IRPS.1984.362051","DOIUrl":null,"url":null,"abstract":"This paper describes a polyimide interlevel metal insulation process. The use of polyimide near high voltage devices can result in anomalous leakage in certain regions at elevated temperatures. The paper summarizes the reliability investigation on discrete devices fabricated with polyimide, as the interlevel material, as well as characterization data which support design criteria permitting the use of polyimide as an interlevel insulation material.","PeriodicalId":326004,"journal":{"name":"22nd International Reliability Physics Symposium","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1984-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Polyimide Interlevel Insulation Process/Design Limitations\",\"authors\":\"D. Bergeron, J. P. Kent, K. Morrett\",\"doi\":\"10.1109/IRPS.1984.362051\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a polyimide interlevel metal insulation process. The use of polyimide near high voltage devices can result in anomalous leakage in certain regions at elevated temperatures. The paper summarizes the reliability investigation on discrete devices fabricated with polyimide, as the interlevel material, as well as characterization data which support design criteria permitting the use of polyimide as an interlevel insulation material.\",\"PeriodicalId\":326004,\"journal\":{\"name\":\"22nd International Reliability Physics Symposium\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1984-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"22nd International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1984.362051\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"22nd International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1984.362051","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes a polyimide interlevel metal insulation process. The use of polyimide near high voltage devices can result in anomalous leakage in certain regions at elevated temperatures. The paper summarizes the reliability investigation on discrete devices fabricated with polyimide, as the interlevel material, as well as characterization data which support design criteria permitting the use of polyimide as an interlevel insulation material.
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