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引用次数: 72
摘要
本文描述了动态可配置的片上系统(CSoC)集成的实际状态和结果,该集成包括SPAR c兼容的LEON处理器核心,PACT XPP Technologies AG公司合适尺寸的商用粗粒度XPP阵列,以及具有高效基于amba的通信接口的应用定制全局/本地存储器拓扑。给定的自适应架构是在工业/学术SoC项目中在卡尔斯鲁厄大学(TH)的0.18和0.13 /spl μ m UMC CMOS技术上合成的。由于CMOS掩模成本呈指数级增长,现在业界的关键方面是soc的适应性,这可以通过将不同粒度的可重构可重用硬件部件集成到可配置的片上系统(csoc)中来实现。
Architecture, memory and interface technology integration of an industrial/ academic configurable system-on-chip (CSoC)
This paper describes the actual status and results of a dynamically configurable system-on-chip (CSoC) integration, consisting of a SPAR C-compatible LEON processor-core, a commercial coarse-grain XPP-array of suitable size from PACT XPP Technologies AG, and application-tailored global/local memory topology with efficient Amba-based communication interfaces. The given adaptive architecture is synthesized within an industrial/academic SoC project onto 0.18 and 0.13 /spl mu/m UMC CMOS technologies at Universitaet Karlsruhe (TH). Due to exponentially increasing CMOS mask costs, essential aspects for the industry are now adaptivity of SoCs, which can be realized by integrating reconfigurable re-usable hardware parts on different granularities into configurable systems-on-chip (CSoCs).