G. Ursan, Maria Ursan, A. D. L. Rosa, Iulian Cosmin Contofan
{"title":"热熔纳米结构胶粘剂的仿真与电磁性能测试的相关性","authors":"G. Ursan, Maria Ursan, A. D. L. Rosa, Iulian Cosmin Contofan","doi":"10.1109/ICEPE.2018.8559821","DOIUrl":null,"url":null,"abstract":"The paper presents aspects related to the simulation of electromagnetic properties in the case of the development of hot melt nanostructured adhesives, and the correlation of these simulations with the results of the preliminary tests performed.","PeriodicalId":343896,"journal":{"name":"2018 International Conference and Exposition on Electrical And Power Engineering (EPE)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Correlations Between Simulation and Electromagnetic Properties Testing of Hot Melt Nanostructured Adhesives\",\"authors\":\"G. Ursan, Maria Ursan, A. D. L. Rosa, Iulian Cosmin Contofan\",\"doi\":\"10.1109/ICEPE.2018.8559821\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents aspects related to the simulation of electromagnetic properties in the case of the development of hot melt nanostructured adhesives, and the correlation of these simulations with the results of the preliminary tests performed.\",\"PeriodicalId\":343896,\"journal\":{\"name\":\"2018 International Conference and Exposition on Electrical And Power Engineering (EPE)\",\"volume\":\"104 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International Conference and Exposition on Electrical And Power Engineering (EPE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPE.2018.8559821\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference and Exposition on Electrical And Power Engineering (EPE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPE.2018.8559821","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Correlations Between Simulation and Electromagnetic Properties Testing of Hot Melt Nanostructured Adhesives
The paper presents aspects related to the simulation of electromagnetic properties in the case of the development of hot melt nanostructured adhesives, and the correlation of these simulations with the results of the preliminary tests performed.