用波形测量高交流电压下的复杂阻抗

Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510) Pub Date : 2004-05-18 DOI:10.1109/IMTC.2004.1351479

J. Obrzut, K. Kano

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引用次数: 1

摘要

我们介绍了波形技术在高交流电压下使用DAQ卡和虚拟仪器确定介电复合薄膜复杂阻抗的应用。对介电性能增强的复合材料进行了介电击穿附近的阻抗表征。由有机树脂和高介电常数改性剂制成的介电杂化材料在高交流电压下表现出与传统玻璃纤维增强环氧树脂层压板完全不同的性能。

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Measurement of complex impedance at high AC voltages using waveforms

We present the application of a waveform technique in determining the complex impedance of dielectric composite films at high AC voltages using a DAQ card and virtual instrumentation. Impedance characterization near dielectric breakdown conditions was performed for composites with enhanced dielectric properties. Dielectric hybrid materials made of organic resins and high dielectric constant modifiers under high AC voltages demonstrated fundamentally different behavior than the conventional fiber-glass reinforced epoxy resin laminates.

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Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510)

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