在2005年制造千兆芯片

P. K. Chatterjee, R. Doering
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引用次数: 2

摘要

从现在起的10年,我们设想以每个功能的成本每年继续下降约25%的速度为不断扩大的电子市场生产千兆芯片。为了应对这一挑战,我们必须继续在工厂和设备方面追求先进的概念,这些概念与连续/同步制造相协同。特别是,这些机会包括:更大的晶圆,单晶圆处理,集群/多处理,实时过程/工厂控制,集成微型环境和基于标准的模块化设计。在大多数情况下,这种变化的开发和实施将需要半导体行业中供应商、客户和竞争对手之间的新水平的合作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Manufacturing gigachips in the year 2005
10 years from now, we envision producing gigachips for an ever expanding electronics market at a cost per function that continues to decrease by approximately 25%/year. To meet this challenge, we must continue to pursue advanced concepts in factories and equipment that are synergistic with continuous/synchronous manufacturing. In particular, such opportunities include: larger wafers, single-wafer processing, clustering/multiprocessing, real-time process/factory control, integrated minienvironments, and standards-based modular design. In most cases, the development and implementation of such change will require new levels of cooperation among suppliers, customers, and competitors in the semiconductor industry.
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