GaAs集成电路:MSI现状与VLSI展望

R. Eden
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引用次数: 15

摘要

GaAs的高电子迁移率,借助于半绝缘GaAs衬底材料,使得实现非常高的开关速度(τd< 100ps)集成电路成为可能,同时表现出非常低的动态开关能量(PDτd< 100fJ)。这种性能的平面砷化镓电路已经被证明。这种栅极面积小于1000µm2的电路为高性能、高密度、低功耗的VLSI技术开辟了道路。本文的目的是总结GaAs对高性能集成电路如此有吸引力的原因,回顾GaAs集成电路开发工作的现状及其在MSI和上MSI(近LSI)电路中的结果,并探讨将该技术扩展到VLSI体系中的前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
GaAs integrated circuits: MSI status and VLSI prospects
The very high electron mobility of GaAs, aided by the use of semi-insulating GaAs substrate material, makes possible the achievement of very high switching speed (τd< 100ps) integrated circuits which can simultaneously exhibit very low dynamic switching energies (PDτd< 100fJ). Planar GaAs circuits of this performance have already been demonstrated. Such circuits, with < 1000µm2gate areas, open the way to an extremely high performance, very dense, low power VLSI technology. It is the purpose of this paper to summarize the reasons why GaAs is so attractive for high performance ICs, to review the present status of GaAs IC development efforts and their results for MSI and upper MSI (near LSI) circuits, and to explore the prospects for the extension of this technology into the VLSI regime.
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