V. Khemka, V. Parthasarathy, R. Zhu, A. Bose, T. Roggenbauer
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引用次数: 1
摘要
在本文中,我们提出并演示了一种新的器件概念,它是传统的还原表面场(RESURF)概念的扩展。在传统的横向DMOSFET (LDMOS)器件结构中引入了重掺杂n型浮动区域,使器件的击穿能力显著提高,同时使其具有高侧能力。这种浮动复用(f复用)器件概念允许在基于薄外延的功率IC技术中实现显着更高的击穿电压。基于FRESURF的概念,提出了几种不同的LDMOS型器件结构,并进行了仿真和实验验证。该器件实现了BV/sub - dss/-R/sub - dson/A的突破性权衡,可以在传统的功率IC技术中制造,而不会增加任何工艺复杂性。BV/sub dss/-R/sub dson/A数字如47 V 0.28m/spl Omega/。厘米/sup 2/或93 V - 0.82米/spl ω /。Cm /sup 2/已经实现,这是业内该类功率器件的最佳报告数据,与使用更复杂的超结技术获得的一些数据相当。
In this paper, we propose and demonstrate a novel device concept, which is an extension of the conventional reduced surface field (RESURF) concept. A heavily doped n-type floating region is introduced in the conventional lateral DMOSFET (LDMOS) device structure which allows the breakdown capability of the device to be increased significantly while at the same time making it high-side capable. This floating RESURF (FRESURF) device concept allows the realization of significantly higher breakdown voltage in a thin epitaxy based power IC technology. Several different LDMOS type device structures based on the FRESURF concept are proposed, simulated and experimentally demonstrated. Breakthrough BV/sub dss/-R/sub dson/A trade-off has been realized using this device, which can be fabricated in a conventional power IC technology without any added process complexity. BV/sub dss/-R/sub dson/A figures like 47 V 0.28m/spl Omega/.cm/sup 2/ or 93 V - 0.82 m/spl Omega/.cm/sup 2/ have been realized, which are best reported figures in the industry for this class of power device and on-par with some of the figures achieved using more complicated superjunction technology.