电磁带隙衬底中形成的互连特性

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI:10.1109/SPI.2005.1500903

A. Suntives, R. Abhari

{"title":"电磁带隙衬底中形成的互连特性","authors":"A. Suntives, R. Abhari","doi":"10.1109/SPI.2005.1500903","DOIUrl":null,"url":null,"abstract":"In this paper, several interconnect geometries - single interconnect and multiple lines - formed in electromagnetic bandgap substrates are investigated through simulations and measurements. Microstrip lines are used as a benchmark to evaluate the performance of the prototype structures.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"286 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Characterizations of interconnects formed in electromagnetic bandgap substrates\",\"authors\":\"A. Suntives, R. Abhari\",\"doi\":\"10.1109/SPI.2005.1500903\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, several interconnect geometries - single interconnect and multiple lines - formed in electromagnetic bandgap substrates are investigated through simulations and measurements. Microstrip lines are used as a benchmark to evaluate the performance of the prototype structures.\",\"PeriodicalId\":182291,\"journal\":{\"name\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"volume\":\"286 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2005.1500903\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2005.1500903","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

本文通过仿真和测量研究了在电磁带隙衬底上形成的几种互连几何形状——单互连和多线互连。利用微带线作为基准来评价原型结构的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Characterizations of interconnects formed in electromagnetic bandgap substrates

In this paper, several interconnect geometries - single interconnect and multiple lines - formed in electromagnetic bandgap substrates are investigated through simulations and measurements. Microstrip lines are used as a benchmark to evaluate the performance of the prototype structures.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.

自引率

0.00%

发文量