{"title":"在高湿环境下,电场加速铜线的GND腐蚀","authors":"Xuanlong Chen, Jianming Fang, Wenfeng Huang, Yong Wei, Chengcheng Chen","doi":"10.1109/IPFA47161.2019.8984767","DOIUrl":null,"url":null,"abstract":"Galvanic corrosion of copper wire in high humidity conditions has been widely studied. Cu-Al system in water forms a battery cell and Al is corroded. The commonly known factors that accelerate the corrosion include humidity, ions, pH, etc. In a real case failure analysis and biased high humidity test, an accelerated corrosion was observed to be related with bias or current direction. The GND copper wire terminal disconnection was proved to be easier to occur, and electrochemical reactions identified as electrolytic cells played a dominant role. The failure mechanism is hard to be recognized sometimes for carbonized molding compound surrounded around the pad, which will lead to an improper conclusion of electrical overstress (EOS). Electrical field accelerated corrosion is a degradation process which might not cause a sudden failure.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrical field accelerated GND corrosion of copper wire in high humidity conditions\",\"authors\":\"Xuanlong Chen, Jianming Fang, Wenfeng Huang, Yong Wei, Chengcheng Chen\",\"doi\":\"10.1109/IPFA47161.2019.8984767\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Galvanic corrosion of copper wire in high humidity conditions has been widely studied. Cu-Al system in water forms a battery cell and Al is corroded. The commonly known factors that accelerate the corrosion include humidity, ions, pH, etc. In a real case failure analysis and biased high humidity test, an accelerated corrosion was observed to be related with bias or current direction. The GND copper wire terminal disconnection was proved to be easier to occur, and electrochemical reactions identified as electrolytic cells played a dominant role. The failure mechanism is hard to be recognized sometimes for carbonized molding compound surrounded around the pad, which will lead to an improper conclusion of electrical overstress (EOS). Electrical field accelerated corrosion is a degradation process which might not cause a sudden failure.\",\"PeriodicalId\":169775,\"journal\":{\"name\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA47161.2019.8984767\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984767","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical field accelerated GND corrosion of copper wire in high humidity conditions
Galvanic corrosion of copper wire in high humidity conditions has been widely studied. Cu-Al system in water forms a battery cell and Al is corroded. The commonly known factors that accelerate the corrosion include humidity, ions, pH, etc. In a real case failure analysis and biased high humidity test, an accelerated corrosion was observed to be related with bias or current direction. The GND copper wire terminal disconnection was proved to be easier to occur, and electrochemical reactions identified as electrolytic cells played a dominant role. The failure mechanism is hard to be recognized sometimes for carbonized molding compound surrounded around the pad, which will lead to an improper conclusion of electrical overstress (EOS). Electrical field accelerated corrosion is a degradation process which might not cause a sudden failure.