原子层沉积制备高迁移率氧化物半导体薄膜晶体管的策略

M. Si, Ziheng Wang, Xiuyan Li
{"title":"原子层沉积制备高迁移率氧化物半导体薄膜晶体管的策略","authors":"M. Si, Ziheng Wang, Xiuyan Li","doi":"10.1109/IFETC53656.2022.9948480","DOIUrl":null,"url":null,"abstract":"In this work, we discuss a strategy for high-mobility oxide semiconductor based on atomic layer deposition process. First, to employ high In content thin film to boost the mobility. Second, to take the advantage of atomically thin film by atomic layer deposition to suppress the crystallization and to form the amorphous phase. Third, to use the quantum confinement effect in nanoscale thickness to modulate the carrier density. As in conventional sputtering deposition approach without the capability of atomically thickness control, high In content films usually lead to high carrier density and crystallization so that carrier concentration is usually too high for practical device. Thus, ALD is an ideal process to realize ultra-thin channel for high mobility oxide semiconductors.","PeriodicalId":289035,"journal":{"name":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Strategy toward High-Mobility Oxide Semiconductor Thin-Film Transistors by Atomic Layer Deposition\",\"authors\":\"M. Si, Ziheng Wang, Xiuyan Li\",\"doi\":\"10.1109/IFETC53656.2022.9948480\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we discuss a strategy for high-mobility oxide semiconductor based on atomic layer deposition process. First, to employ high In content thin film to boost the mobility. Second, to take the advantage of atomically thin film by atomic layer deposition to suppress the crystallization and to form the amorphous phase. Third, to use the quantum confinement effect in nanoscale thickness to modulate the carrier density. As in conventional sputtering deposition approach without the capability of atomically thickness control, high In content films usually lead to high carrier density and crystallization so that carrier concentration is usually too high for practical device. Thus, ALD is an ideal process to realize ultra-thin channel for high mobility oxide semiconductors.\",\"PeriodicalId\":289035,\"journal\":{\"name\":\"2022 IEEE International Flexible Electronics Technology Conference (IFETC)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-08-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Flexible Electronics Technology Conference (IFETC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IFETC53656.2022.9948480\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Flexible Electronics Technology Conference (IFETC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IFETC53656.2022.9948480","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在本工作中,我们讨论了一种基于原子层沉积工艺的高迁移率氧化物半导体策略。首先,采用高含量的薄膜来提高迁移率。二是利用原子薄膜的优势,通过原子层沉积抑制晶化,形成非晶相。第三,利用纳米级厚度的量子约束效应调制载流子密度。由于传统的溅射沉积方法没有原子厚度控制的能力,高铟含量的薄膜通常导致载流子密度和结晶,从而导致载流子浓度过高。因此,ALD是实现高迁移率氧化物半导体超薄通道的理想工艺。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Strategy toward High-Mobility Oxide Semiconductor Thin-Film Transistors by Atomic Layer Deposition
In this work, we discuss a strategy for high-mobility oxide semiconductor based on atomic layer deposition process. First, to employ high In content thin film to boost the mobility. Second, to take the advantage of atomically thin film by atomic layer deposition to suppress the crystallization and to form the amorphous phase. Third, to use the quantum confinement effect in nanoscale thickness to modulate the carrier density. As in conventional sputtering deposition approach without the capability of atomically thickness control, high In content films usually lead to high carrier density and crystallization so that carrier concentration is usually too high for practical device. Thus, ALD is an ideal process to realize ultra-thin channel for high mobility oxide semiconductors.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信