N. Xu, Jeff Sun, I. Chen, L. Hutin, Yenhao Chen, J. Fujiki, Chuang Qian, T. Liu
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Hybrid CMOS/BEOL-NEMS technology for ultra-low-power IC applications
Three-dimensional (3-D) nano-electro-mechanical (NEM) switches (relays) are proposed to reduce the die area and power consumption of digital logic and memory circuits.
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