N. Handa, Satomi Hamada, M. Imai, Y. Wada, Hiroshi Sobukawa, Hirokuni Hiyama, K. Amagai
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Particle removal characteristics in liquid flow during wafer rotation
With the miniaturization of the semiconductor, the slurry size used in CMP process tends to become small, and it is demanded to clean wafer efficiently after CMP. Therefore characteristic of particle removal in the liquid flow on a rotating wafer is investigated using the pollution sample wafer with the silica particle. Furthermore, particle removal properties in the liquid flow on a rotating wafer is clarified by comparing it with the visualization image of the liquid flow on a rotating wafer.
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