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引用次数: 6
摘要
本文报道了温度对采用欧姆和肖特基两种不同源极/漏极接触电极制备的背增强(BE) SOI MOSFET的影响。BE SOI MOSFET(专利号BR 102015020974-6, 2015)是一种无掺杂无结SOI晶体管,其工作原理类似于n型或p型MOS,具体取决于后置偏置条件。尽管在源极/漏极处的肖特基触点是强制性的,以便使两种类型的晶体管以相似的方式工作,但使用欧姆触点可能会呈现出一些特殊的优点。结果表明,只有在欧姆源漏接触器件中才存在零温度系数偏置条件。观察到,当温度升高时,肖特基接触电阻降低,导致电流增大,从而导致ZTC的缺失。通过实验测量和仿真对这种效应进行了解释。
Is there a Zero Temperature bias point (ZTC) on Back Enhanced (BE) SOI MOSFET?
This paper reports the temperature influence on the Back Enhanced (BE) SOI MOSFET fabricated with two different source/drain contact electrodes: Ohmic and Schottky. The BE SOI MOSFET (Patent BR 102015020974-6, 2015) is a kind of undoped junction-less SOI transistor, which works like an n-type or p-type MOS, depending on the back bias conditions. In spite of the Schottky contact at source/drain is mandatory in order to have both type of transistor working in a similar way, the use of Ohmic contact may present some specials advantages. The results showed the presence of a ZTC (Zero Temperature Coefficient) bias condition only in the device with Ohmic source/drain contact. It was observed that the Schottky contact resistance decreased when the temperature increases resulting in a higher current and consequently the absence of the ZTC. This effect is explained through experimental measurements and simulation.