纳米SiC添加银浆烧结模贴，用于SiC功率器件

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Pub Date : 2014-11-24 DOI:10.1109/ESTC.2014.6962832

Hao Zhang, S. Nagao, Sungwon Park, Shunsuke Koga, T. Sugahara, K. Suganuma

{"title":"纳米SiC添加银浆烧结模贴，用于SiC功率器件","authors":"Hao Zhang, S. Nagao, Sungwon Park, Shunsuke Koga, T. Sugahara, K. Suganuma","doi":"10.1109/ESTC.2014.6962832","DOIUrl":null,"url":null,"abstract":"Low temperature and low pressure sintering Ag paste composed by sub-micro Ag particle and organic solvent was presented. The apparent improvement of bonding strength was realized by adding small amount of nano thickness Ag flake. Optimum proportion of sub-micro particle and nano thickness flake was determined. Nano-SiC particles were added into the optimized paste for sake of the possibility of properties advancement. The electrical property of newly developed Ag paste was measured by an improved test method. SiC die attachment and DBC (Direct Bonding Cu) substrate was conducted to test the practical application prospect of newly developed Nano-SiC added Ag paste.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Nano-SiC added Ag paste sintering die-attach for SiC power devices\",\"authors\":\"Hao Zhang, S. Nagao, Sungwon Park, Shunsuke Koga, T. Sugahara, K. Suganuma\",\"doi\":\"10.1109/ESTC.2014.6962832\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Low temperature and low pressure sintering Ag paste composed by sub-micro Ag particle and organic solvent was presented. The apparent improvement of bonding strength was realized by adding small amount of nano thickness Ag flake. Optimum proportion of sub-micro particle and nano thickness flake was determined. Nano-SiC particles were added into the optimized paste for sake of the possibility of properties advancement. The electrical property of newly developed Ag paste was measured by an improved test method. SiC die attachment and DBC (Direct Bonding Cu) substrate was conducted to test the practical application prospect of newly developed Nano-SiC added Ag paste.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962832\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962832","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

提出了一种由亚微量银颗粒和有机溶剂组成的低温低压烧结银浆料。通过添加少量纳米厚度银片，可以明显提高结合强度。确定了亚微米颗粒与纳米厚度薄片的最佳比例。在优化后的浆料中加入纳米sic颗粒，考察其性能提升的可能性。采用改进的测试方法对新研制的银膏体的电性能进行了测试。为了验证新开发的纳米SiC加银膏体的实际应用前景，对SiC贴片和DBC (Direct Bonding Cu)衬底进行了测试。

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Nano-SiC added Ag paste sintering die-attach for SiC power devices

Low temperature and low pressure sintering Ag paste composed by sub-micro Ag particle and organic solvent was presented. The apparent improvement of bonding strength was realized by adding small amount of nano thickness Ag flake. Optimum proportion of sub-micro particle and nano thickness flake was determined. Nano-SiC particles were added into the optimized paste for sake of the possibility of properties advancement. The electrical property of newly developed Ag paste was measured by an improved test method. SiC die attachment and DBC (Direct Bonding Cu) substrate was conducted to test the practical application prospect of newly developed Nano-SiC added Ag paste.

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Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)

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