新的低电阻和紧凑的mosfet模拟开关ic与v槽介电隔离

K. Hara, J. Sakano, H. Honda, Junichi Aizawa, Taiga Arai
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引用次数: 1

摘要

采用介电隔离(DI)工艺技术,提出了一种用于模拟开关集成电路的低阻紧凑MOSFET。为了获得高电流密度,我们开发了一种具有内凸的新型MOSFET,它可以降低高击穿电压器件的漂移电阻。用于电平移位器的新型N-ch和P-ch紧凑型mosfet也被开发出来,它们可以通过使用结场效应晶体管结构来控制栅极区域下的低电场饱和电流,从而提高热载流子的可靠性。在220v器件中,这些mosfet的面积可缩小约40%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New low-resistance and compact MOSFETs for analog switch ICs with V-groove dielectric isolation
A low-resistance and compact MOSFET for analog switch ICs with Dielectric Isolation (DI) process technology is proposed. To obtain a high current density, we have developed new MOSFET with internal prominence, which reduce the drift resistance of devices with a high breakdown voltage. New N-ch and P-ch compact MOSFETs for level shifters have also been developed that can control saturation current with a low electric field under the gate region by using a junction field effect transistor structure for higher hot carrier reliability. The areas of these MOSFETs can be shrunk about 40% in 220-V devices.
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