用于系统面板和三维集成电路的隧道薄膜晶体管的正偏置温度不稳定性

William Cheng-Yu Ma, Hui-Shun Hsu, Che-Yu Jao, C.-C. Fang, Tzu-Han Liao
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引用次数: 3

摘要

首次提出了多晶硅沟道薄膜隧道薄膜晶体管(TFT)的正偏置温度不稳定性。隧道tft的新型带间隧道输运机制导致了特殊的PBTI行为。对于75°C、应力电压为10 V的PBTI,与传统TFT相比,隧道TFT具有出色的PBTI抗抗性。然而,随着PBTI温度的降低,隧道tft的降解越来越严重。这可能是由于深阱特性使带间隧穿在低温下更加敏感,从而影响了隧穿电子的输运行为。这对隧道晶体管的发展有一定的帮助。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Positive bias temperature instability of tunnel thin-film transistor for applications of system-on-panel and three-dimension integrated circuits
Positive bias temperature instability (PBTI) of tunnel thin-film transistor (TFT) with poly-Si channel film is proposed for the first time. The novel interband tunneling transport mechanism of tunnel-TFT results in special PBTI behavior. For PBTI at 75 °C with stress voltage 10 V, tunnel-TFT exhibit excellent PBTI immunity compared to conventional TFT. However, the degradation of tunnel-TFT is getting worse when the temperature of PBTI is reduced. It may be because the interband tunneling is more sensitive at low temperature due to the deep trap characteristics, which affects the transport behavior of tunneling electrons. It would be helpful for the development of tunnel transistors.
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