体CMOS技术中温度升高对数字单事件瞬态脉冲宽度的影响

M. Gadlage, J. Ahlbin, B. Narasimham, V. Ramachandran, C. Dinkins, B. Bhuva, peixiong zhao, R. Shuler
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引用次数: 14

摘要

组合逻辑软误差将成为先进技术的主要可靠性问题。影响软误差率的主要因素之一是单事件瞬态(SET)脉冲宽度。由漂移、扩散和寄生双极晶体管参数控制的SET脉冲宽度是工作温度的重要函数。在这项工作中,重离子诱导的SET脉冲宽度在25°到100°C的温度范围内,具有自主SET捕获电路。在90nm块体CMOS技术上的实验和仿真结果表明,随着工作温度的升高,平均SET脉冲宽度增加了37%,在更高温度下,一些脉冲的长度接近2ns。SET脉冲宽度的增加可以用双极放大对温度的依赖来解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of elevated temperature on digital single event transient pulse widths in a bulk CMOS technology
Combinational logic soft errors are expected to be the dominant reliability issue for advanced technologies. One of the major factors affecting the soft-error rates is single-event transient (SET) pulse widths. The SET pulse widths, which are controlled by drift, diffusion, and parasitic bipolar transistor parameters, are a strong function of operating temperature. In this work, heavy-ion induced SET pulse widths are reported at temperatures ranging from 25° to 100° C with an autonomous SET capture circuit. Experimental and simulation results in a 90nm bulk CMOS technology indicate an increase as high as 37% in average SET pulse width with increasing operating temperature, with some pulses almost 2 ns long at higher temperatures. The increase in the SET pulse width can be explained by the dependence of bipolar amplification on temperature.
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