大功率晶闸管的玻璃钝化结构

1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings Pub Date : 1997-10-07 DOI:10.1109/SMICND.1997.651603

C. Liiceanu, A. Nichita, V. Marinescu, D. Liiceanu, F. Ţurţudău

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引用次数: 0

摘要

采用密封管扩散、晶圆两侧的台面蚀刻和升空金属化技术，制造了一种低成本、可靠的35 Arms晶闸管玻璃钝化结构。通过对触发机制的二维仿真，设计了最佳权衡I/sub G_T_/d/spl nu//dt性能，并对计算值进行了实验验证。

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Glass passivated structure for high power thyristors

A low cost and reliable glass passivated structure for 35 Arms thyristors has been manufactured using sealed tube diffusions, mesa etching from both sides of the wafer and a lift-off metallisation technique. Best trade-off I/sub G_T_/d/spl nu//dt performance has been designed using two dimensional simulation of triggering mechanisms, followed by experimental validation of calculated values.

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1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings

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