高温用金刚石基金属半导体触点

1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132) Pub Date : 1998-02-22 DOI:10.1109/HTEMDS.1998.730693

H. Fecht, C. Ettl, M. Werner

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引用次数: 0

摘要

微系统技术允许在一个产品中集成多个功能。不断小型化的趋势和相应的集成密度的增加是对使用中的材料的进一步挑战，特别是在高温下。对于高温应用，使用宽带隙半导体，如金刚石。讨论了几种材料的相关性能，特别是稳定触点的制造。

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Diamond based metal-semiconductor contacts for elevated temperatures

Microsystems technology allows the integration of several functions within one product. The tendency towards continous miniaturization and the corresponding increase in integration density is a further challenge to the materials in use, in particular at elevated temperatures. For high temperature applications, wide bandgap semiconductors, such as diamond, are used. Several materials related properties are discussed, in particular for the manufacture of stable contacts.

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1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)

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