一种适用于低功耗应用的新型低面积开销体偏置FPGA架构

Sungmin Bae, K. Ramakrishnan, N. Vijaykrishnan
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引用次数: 6

摘要

随着技术规模的扩大,泄漏功率在芯片总功耗中占主导地位,在45纳米技术中,泄漏功率在高温下可达到50%甚至更高。由于fpga的可重构特性和大量非活动资源,泄漏功耗对fpga来说尤其成问题。体偏置是一种有效的降低漏电流的技术,已广泛应用于45nm工艺的低功耗架构中。具有粗粒度体偏置控制的fpga仅产生约10%的面积开销,而将粒度增加到最细级别则会显着增加超过100%的面积开销。然而,粗粒度体偏置控制FPGA可能无法获得令人满意的泄漏功率降低,因为通过资源的所有路径必须有足够的松弛。为了克服分配限制,我们提出了一种新的FPGA架构,该架构在粗粒度架构级别上使用体偏置技术和时钟倾斜调度。时钟偏差调度技术只会产生3.35%的额外面积开销,以便将空闲分配给资源,而不是增加最小体偏差粒度。此外,我们提出了一种身体偏差分配算法来利用所提出的架构。实验结果表明,与粗粒度结构61%的平均泄漏减少率相比,该结构的平均泄漏减少率约为76%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel Low Area Overhead Body Bias FPGA Architecture for Low Power Applications
As technology scales, leakage power shares a dominant part in the total power dissipation of the chip and reaches up to 50% or even higher at elevated temperatures in 45 nm technology. Leakage power dissipation is especially problematic for FPGAs due to their reconfigurable nature and large number of inactive resources. Body biasing is an efficient technique to reduce leakage current which has been widely adopted in 45nm technology low power architectures.FPGAs with coarse grained body bias control only incurred about 10% of the area overhead while increasing the granularity to the finest level dramatically increases the area overhead over 100%. However, the coarse grained body bias control FPGA may not result in satisfactory leakage power reduction since all the paths passing a resource must have enough slacks. To overcome the assignment limitation, we propose a novel FPGA architecture which uses body biasing technique and clock skew scheduling at a coarse grained architecture level. Clock skew scheduling technique only incurs 3.35% of additional area overhead in order to distribute slack to the resource instead of increasing the minimum body-bias granularity. Further, we propose a body bias assignment algorithm to leverage the proposed architecture. Experimental results demonstrate that the proposed architecture achieved an average leakage reduction of about 76% as compared to 61% of coarse grained architecture.
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