{"title":"高速处理器板的电源平面去耦策略","authors":"Tushar K. Roy, L. Smith","doi":"10.1109/EPEP.1999.819212","DOIUrl":null,"url":null,"abstract":"New generations of high speed processors are requiring more power. Consequently, in order to cope with the high amount of switching currents, efficient decoupling of power planes has become critical for both signal integrity (SI) and EMC. In this paper, an investigation has been conducted to find out the effects of decoupling capacitors on SI. A procedure for optimization of the decoupling capacitors based on the fundamental frequency and harmonic frequencies has been illustrated. The optimized decoupling strategy was then implemented on a dual processor board and was measured on a network analyzer. The authors have examined the effect of the decoupling strategy on SI.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Power plane decoupling strategy for high speed processor boards\",\"authors\":\"Tushar K. Roy, L. Smith\",\"doi\":\"10.1109/EPEP.1999.819212\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New generations of high speed processors are requiring more power. Consequently, in order to cope with the high amount of switching currents, efficient decoupling of power planes has become critical for both signal integrity (SI) and EMC. In this paper, an investigation has been conducted to find out the effects of decoupling capacitors on SI. A procedure for optimization of the decoupling capacitors based on the fundamental frequency and harmonic frequencies has been illustrated. The optimized decoupling strategy was then implemented on a dual processor board and was measured on a network analyzer. The authors have examined the effect of the decoupling strategy on SI.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819212\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819212","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Power plane decoupling strategy for high speed processor boards
New generations of high speed processors are requiring more power. Consequently, in order to cope with the high amount of switching currents, efficient decoupling of power planes has become critical for both signal integrity (SI) and EMC. In this paper, an investigation has been conducted to find out the effects of decoupling capacitors on SI. A procedure for optimization of the decoupling capacitors based on the fundamental frequency and harmonic frequencies has been illustrated. The optimized decoupling strategy was then implemented on a dual processor board and was measured on a network analyzer. The authors have examined the effect of the decoupling strategy on SI.