Yung-Shou Jeng, Wei-Da Guo, G. Shiue, Chien-Min Lin, R. Wu
{"title":"基于神经网络方法的微导过渡无反射设计","authors":"Yung-Shou Jeng, Wei-Da Guo, G. Shiue, Chien-Min Lin, R. Wu","doi":"10.1109/EPEP.2007.4387145","DOIUrl":null,"url":null,"abstract":"Based on the concept of impedance matching, this paper presents a novel design method that can efficiently achieve the least reflection noise for differentia-via transitions. The relation between the effective via-impedance and the physical dimension is well approximated by a three-layer neural network. In use of the full-wave simulation, the time-domain reflectometry waveform is also acquired to confirm the accuracy of the proposed approach.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Reflectionless Design for Differential-Via Transitions Using Neural Network-Based Approach\",\"authors\":\"Yung-Shou Jeng, Wei-Da Guo, G. Shiue, Chien-Min Lin, R. Wu\",\"doi\":\"10.1109/EPEP.2007.4387145\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Based on the concept of impedance matching, this paper presents a novel design method that can efficiently achieve the least reflection noise for differentia-via transitions. The relation between the effective via-impedance and the physical dimension is well approximated by a three-layer neural network. In use of the full-wave simulation, the time-domain reflectometry waveform is also acquired to confirm the accuracy of the proposed approach.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387145\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387145","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reflectionless Design for Differential-Via Transitions Using Neural Network-Based Approach
Based on the concept of impedance matching, this paper presents a novel design method that can efficiently achieve the least reflection noise for differentia-via transitions. The relation between the effective via-impedance and the physical dimension is well approximated by a three-layer neural network. In use of the full-wave simulation, the time-domain reflectometry waveform is also acquired to confirm the accuracy of the proposed approach.