COB封装[板载芯片]中水分扩散的研究

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298768

Weidong Huang, Xuhong Wang, Li Wang, M. Sheng, Liqiang Xu, F. Stubhan, L. Luo

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引用次数: 0

摘要

在三种不同的温度/湿度环境下，通过线接在FR4板上的湿度传感器测量了globtop材料、globtop涂覆SiNx薄膜、globtop涂覆硅树脂和globtop涂覆SiNx +硅树脂中的水分扩散。利用有限元法和菲克扩散定律对实验结果进行了模拟。计算水分扩散系数，定量比较不同涂层的防潮性能。实验和仿真结果表明，SiNx +有机硅双层涂层既能使PCB表面光滑，又能保持无机膜良好的防潮性能，具有优异的防潮性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Investigation on moisture diffusion in COB packaging [chip on board]

The moisture diffusion in globtop material, globtop coated with SiNx film, globtop coated with silicone and globtop coated with SiNx plus silicone were measured by humidity sensors wire-bonded on FR4 boards in three different temperature/humidity environments. The experimental results were simulated by the finite element method and Fick diffusion law. The moisture diffusion coefficients were calculated to quantitatively compare various coatings' moisture-resistance. Our experimental and simulation results show that a double-layered coating with SiNx plus silicone has excellent moisture-resistance because it can not only smooth the steps on the PCB but also keep the good moisture-resistance of inorganic films.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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