物联网道路上的成本挑战

W. Rhines
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引用次数: 0

摘要

物联网(IoT)的一大前景是,智能传感器和执行器以及用于信息处理的大型数字芯片都需要非常大量的半导体组件。然而,设计规则的缩减、超低功耗混合信号设计和多样化封装带来的复杂性日益增加,正威胁着过去推动半导体行业增长的每晶体管成本的传统降低。Rhines博士将分析半导体设计和生产成本的演变,以预测未来十年设计师将不得不使用什么以及将启用哪些功能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cost challenges on the way to the Internet of Things
One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional reduction in cost per transistor that has fueled semiconductor industry growth in the past. Dr. Rhines will analyze the evolution of semiconductor design and production costs to provide predictions of what designers will have to work with in the coming decade and what capabilities will be enabled.
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