{"title":"射频稳定","authors":"D. Staggs","doi":"10.1109/isemc.1986.7568272","DOIUrl":null,"url":null,"abstract":"This paper presents a new technique for emission control of Electronic Systems. The technique, called \"RF Stabilization\" reduces Conducted and Radiated emissions and raises immunity levels significantly. Three design areas are examined in implementation of this technique; Multipoint High Frequency Grounding, Circuit Board Design, and Internal Harness (Cable) Design. Conducted and Radiated emission data is presented showing the reduction of the emissions due to changes in the design areas.","PeriodicalId":244612,"journal":{"name":"1986 IEEE International Symposium on Electromagnetic Compatibility","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1986-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"RF Stabilization\",\"authors\":\"D. Staggs\",\"doi\":\"10.1109/isemc.1986.7568272\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a new technique for emission control of Electronic Systems. The technique, called \\\"RF Stabilization\\\" reduces Conducted and Radiated emissions and raises immunity levels significantly. Three design areas are examined in implementation of this technique; Multipoint High Frequency Grounding, Circuit Board Design, and Internal Harness (Cable) Design. Conducted and Radiated emission data is presented showing the reduction of the emissions due to changes in the design areas.\",\"PeriodicalId\":244612,\"journal\":{\"name\":\"1986 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":\"64 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1986-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1986 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/isemc.1986.7568272\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1986 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/isemc.1986.7568272","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper presents a new technique for emission control of Electronic Systems. The technique, called "RF Stabilization" reduces Conducted and Radiated emissions and raises immunity levels significantly. Three design areas are examined in implementation of this technique; Multipoint High Frequency Grounding, Circuit Board Design, and Internal Harness (Cable) Design. Conducted and Radiated emission data is presented showing the reduction of the emissions due to changes in the design areas.
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